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速递书局
| 封面: |   |  
| 题名: | Emerging food packaging technologies |  
| 作者: | Kit L. Yam (Editor), Dong Sun Lee (Editor) |  
| 出版社: | Woodhead Publishing |  
| 出版日期: | (May 3, 2012) |  
| ISBN: | 1845698096 |  
| 附属页: | 齐全 |  
| 书签: | 有 |  
| 格式: | 清晰PDF |  
| 内容简介: | Book Description Publication Date: May 3, 2012 | ISBN-10: 1845698096 | ISBN-13: 978-1845698096
 
 The successful employment of food packaging can greatly improve product safety and quality, making this area a key concern for the food processing industry. This book reviews advances in packaging materials, the design and implementation of smart packaging techniques, and developments in response to growing concerns about packaging sustainability.  Part one of focuses on developments in active packaging, reviewing controlled release packaging, active antimicrobials and nanocomposites in packaging, and edible chitosan coatings. Part two goes on to consider intelligent packaging and how advances in the consumer/packaging interface can improve food safety and quality. Part three analyzes developments such as nanocomposites, emerging coating technologies, light-protective and non-thermal process packaging in packaging material and concludes with a consideration of the safety of plastics as food packaging materials. Finally, part four explores the use of eco-design, life cycle assessment, and the utilization of bio-based polymers in the production of smarter, environmentally-compatible packaging.
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