题名 | The controlled punch through (CPT) IGBT the next step in buffer optimization for thin wafer technology |
作者 | J. Vobecky 1 ; M. Rahimo 1 ; A. Kopta 1 ; S. Linder 1 |
链接 | http://digital-library.theiet.org/content/conferences/10.1049/ic_20080221 |
多谢多谢
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