科研速递论坛

标题: Ultrasonic Bonding of Cone Bump for Integration of Large-Scale Integrated Cir... [打印本页]

作者: pnas2009 时间: 2015-10-6 08:52
标题: Ultrasonic Bonding of Cone Bump for Integration of Large-Scale Integrated Cir...

题名	Ultrasonic Bonding of Cone Bump for Integration of Large-Scale Integrated Circuits in Flexible Electronics
链接	http://iopscience.iop.org/article/10.7567/JJAP.52.05DB10/pdf

作者: ahaqwg 时间: 2015-10-6 08:52
http://1000eb.com/1gep3

作者: ahaqwg 时间: 2015-10-6 08:55
11111111111111111

欢迎光临科研速递论坛 (http://www.expaper.cn/)