题名 | A study of interdiffusion in multilayer Cu/Ni films by Auger electron depth profiling |
作者 | K. Röll, W. Reill |
杂志 | Thin Solid Films |
年|卷|期 | Volume 89, Issue 2, 12 March 1982 |
页码 | Pages 221–224 |
链接 | http://www.sciencedirect.com/science/article/pii/0040609082904527 |
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