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标题: Stress Analysis of the Low-k Layer in a Flip-Chip Package with an Oblong Copp... [打印本页]

作者: yjgnxh 时间: 2017-10-7 09:03
标题: Stress Analysis of the Low-k Layer in a Flip-Chip Package with an Oblong Copp...

题名	Stress Analysis of the Low-k Layer in a Flip-Chip Package with an Oblong Copper Pillar Bump
作者	Song, Cha Gyu; Kwon, Oh Young; Jung, Hoon Sun; Sohn, EunSook; Choa, Sung-Hoon
杂志	Nanoscience and Nanotechnology Letters
年\|卷\|期	Volume 9, Number 8, August 2017
页码	1139-1145
链接	http://chinesesites.library.ingentaconnect.com/content/asp/nnl/2017/00000009/00000008/art00001

作者: Ferrari 时间: 2017-10-7 09:03
http://disk.680.com/BR3Inu

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